Method and apparatus for a metallic dry-filling process

ABSTRACT

An iPVD system is programmed to deposit uniform material, such as a metallic material, into high aspect ratio nano-sized features on semiconductor substrates using a process that enhances the feature filling compared to the field deposition, while maximizing the size of the grain features in the deposited material opening at the top of the feature during the process. Plural sequential dry filling plasma processes are used with backside gas pressure varied to control substrate temperature.

This application is related to commonly assigned and co-pending U.S.Patent Application Publication No. 20040188239, filed Mar. 5, 2004,which is a Continuation-in-Part of U.S. Pat. No. 6,755,945, and toco-pending U.S. Patent Application Express Mail No. EV488818521US,titled “A METHOD AND APPARATUS FOR A METALLIC DRY-FILLING PROCESS” filedon even date herewith, all hereby expressly incorporated herein byreference.

FIELD OF THE INVENTION

The invention relates to the metallization of via and trench structureson semiconductor wafers. More particularly, the invention relates to thedry-filling of high aspect ratio via and trench structures of siliconwafers utilizing ionized metallic materials.

BACKGROUND OF THE INVENTION

In the metallization of high aspect ratio vias and trenches onsemiconductor wafers, it is required that the barrier and seed layerhave good sidewall coverage. It is also important to have a void-freemetal deposition.

Ionized PVD deposition is used for barrier and seed layer metallizationin advanced IC wafers. Ionized PVD provides good sidewall and bottomcoverage in via and trench structures. However, as the geometries shrinkand as the via dimensions go down below 0.15 micrometers, ionizeddeposition requirements become more critical. Therefore, it is highlydesirable to have an ionized PVD process where bottom and sidewallcoverage are well balanced and overhang is minimized.

Accordingly, there is a need to further control the quality of the metaldeposited in high aspect ratio vias and trenches during the depositionstep.

SUMMARY OF THE INVENTION

The invention provides a method of filling a plurality of ultra-small(nano-sized) features by applying a first backside pressure to abackside of the patterned substrate using a backside gas therebyestablishing a substrate temperature; creating a first dry-fillingplasma during a first dry-filling process, wherein a first amount ofmetal is deposited at a first rate into a plurality of nano-sizedfeatures of the patterned substrate; changing a thermal conductivitybetween the substrate holder and the patterned substrate by applying asecond backside pressure, wherein the second backside pressure isdifferent than the first backside pressure thereby allowing thesubstrate temperature to change; creating a second dry-filling plasmaduring a second dry-filling process, wherein a second amount of metal isdeposited at a second rate into the plurality of nano-sized features ofthe patterned substrate. For example, the thermal conductivity betweenthe substrate holder and the patterned substrate is decreased byapplying a second backside pressure that is less than the first backsidepressure to allow the substrate temperature to increase. Further,following the first or second dry filling process or both, the plasmamay be extinguished during a shutdown time to allow the substratetemperature to decrease.

Further, the method may be performed by using a deposition system thatincludes a processing chamber, a gas supply system coupled to theprocessing chamber, an inductively coupled plasma (ICP) source coupledto the processing chamber, a metallic target coupled to the processingchamber, a DC source coupled to the metallic target, a substrate holdercoupled to the processing chamber, a RF bias generator coupled to thesubstrate holder, and a backside gas supply system coupled to thesubstrate holder, the method includes clamping a patterned substrateonto the substrate holder, wherein the substrate holder comprises anelectrostatic chuck and an electrostatic force is applied to thepatterned substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete understanding of various embodiments of the inventionand many of the attendant advantages thereof will become readilyapparent with reference to the following detailed description,particularly when considered in conjunction with the accompanyingdrawings, in which:

FIGS. 1A-1C illustrate a simplified view of a dry-filling process inaccordance with an embodiment of the invention;

FIG. 2A illustrates an exemplary block diagram of a processing systemaccording to an embodiment of the invention;

FIG. 2B illustrates an exemplary block diagram of a processing systemaccording to an alternate embodiment of the invention;

FIG. 3 illustrates a simplified block diagram of a substrate holder inaccordance with an embodiment of the invention;

FIG. 4 illustrates a simplified flow diagram of a method of operating adeposition system to perform a process in accordance with an embodimentof the invention;

FIGS. 5 and 6 illustrate graphs of exemplary results in accordance withembodiments of the invention; and

FIG. 7 illustrates a graph of additional exemplary results in accordancewith embodiments of the invention.

DETAILED DESCRIPTION OF SEVERAL EMBODIMENTS

A process is described in U.S. Pat. No. 6,755,945 by Yasar et al., whichis assigned to the assignee of the present application and providesionized PVD with sequential deposition and etching. While with this typeof sequencing the overhang or overburden are much improved over priorprocesses, some will still form during the deposition sequence and maynot be entirely removed in the etch sequence when the substrate includesnano-sized (ultra-small) features. For example, nano-sized features mayhave critical dimensions less than 100 nm and depths greater than 250nm.

Yasar et al. describe a technique to deposit and etch multiple timeswithin a single vacuum chamber. Overhangs and field deposition are notfundamentally controlled within the deposition step of this process.Higher bias powers are typically used in the deposition step to depositas much bottom coverage as possible before etching back the bottom toredistribute material to the sidewalls and reduce the bottom coverage,which can add to line resistance. Reduction of overhang and fielddeposition is achieved in the subsequent etch steps.

The invention provides a method of operating an ionized physical vapordeposition (iPVD) system to deposit metallic material into nano-sizedfeatures on a patterned substrate on an electrostatic chuck within aprocessing chamber. The method can include a No Net Deposition (NND)process, where the process parameters are adjusted to cause the netdeposition rate to be approximately zero in the field area of thepatterned substrate. The iPVD system may also be used to depositmetallic material using a Low Net Deposition (LND) process, where theprocess parameters are adjusted to establish an ultra-low depositionrate in a field area of the patterned substrate.

The field area refers to the upper surface of the substrate beingprocessed and is the surface into which the nano-sized features, such ashigh aspect ratio vias and trenches, extend. An ultra-low depositionrate as referred to herein is a deposition rate of less than about 30nanometers per minute.

An iPVD processing system can be used for the LND and NND processes.These processes can be typically performed in the vacuum processingchamber of an iPVD apparatus in which the substrate to be processed isheld on a support. A high-density plasma is maintained in the chamber ina processing gas, which can be, for example, an inert gas into whichmetal or other filling material has been introduced, usually bysputtering from a target. The high-density plasma can be ionized bycoupling RF energy into the process gas, often by an inductive couplingfrom outside of the chamber. The RF energy ionizes both the process gasand a fraction of the dry-filling material, which may be to a low plasmapotential of only a few volts, but may be higher. The processing gas andthe ionized dry-filling material can then be directed onto the substrateto fill the nano-sized features on the substrate. For the dry-fillingprocesses of the present invention, an iPVD process can be used. Theparameters of the iPVD process are controlled to produce a substantiallyuniform fill across the surface of the substrate with substantially nodeposition in the field area of the substrate. When so controlled, theiPVD process produces the desired result of back filling withoutproducing overhangs around the feature openings. Alternatively, an iPVDprocess may not be required as PVD and other deposition processes maybenefit from principles of the invention.

Exemplary embodiments of the method of the invention are describedbelow, which disclose dry-filling techniques for use with an iPVD systemto metallize high aspect ratio vias and trenches by depositing ionizedmetal. In one example, substrate processing may include depositing athin layer of a barrier metal, depositing a metallic seed layer, and thedry-filling with a metal such as Cu. In another example, substrateprocessing may include depositing a thin layer of a barrier metal, andthe dry-filling with a metal such as Cu.

This invention is distinctly different from prior art which teaches highDC powers with high RF bias powers for increased conformality or thecase where several deposition and etch steps are performed within or indifferent vacuum chambers. This process is characterized by very lowdeposition rates in the field area of the substrate and substantiallylarger deposition rates into the nano-sized features of the substrate.For example, the DC power can be reduced to reduce the deposition rateto less than 10 nm/min. Additionally, a range of backside pressures canbe applied to the substrate during the deposition.

In addition, other deposition techniques use electro-plating processes.The self-annealing of electroplated (EP) films, lines, and/or vias hasprovided manufacturing issues such as reliability and reproducibilityproblems because of changes in the grain size and hardness of thedeposited copper.

The present invention eliminates the problems associated with theelectroplating techniques. The dry-filling processes described hereinhave the capability to fill nano-sized features of the patternedsubstrate in a bottom-up manner without producing voids and withoutdepositing a significant amount of material in the field area of thepatterned substrate.

FIGS. 1A-1C illustrate a simplified view of a dry-filling process inaccordance with an embodiment of the invention. In the illustratedembodiment, a three-step process is shown, but this is not required forthe invention. Alternatively, a different number of steps may be used.

In FIG. 1A, a simplified cross-section is shown for a substrate 105 anda feature structure 110 that can represent a trench or a via. In theillustrated embodiment, a single feature is shown, but this is forillustration purposes only.

A barrier layer 115 is shown on the top surface 106 of the substrate105, the sidewall surface 111 of the feature 110, and the bottom surface112 of the feature 110. In addition, a seed layer 120 is shown on top ofthe barrier layer 115 on the sidewall surface 111 of the feature 110,and on the bottom surface 112 of the feature 110 of the surface.

In the illustrated embodiment shown in FIG. 1A, a first portion ofmaterial 130A is shown in the bottom portion of the feature. Forexample, the first portion of material 130A can be deposited during afirst dry-filling process. Alternatively, this first portion can bedeposited during a seed layer deposition.

The barrier and seed layer have uniform coverage along the highaspect-ratio feature sidewall surfaces, and have minimum overhang 135 atthe top opening 140 of the features. The barrier/seed layers cancomprise sputtered Ta/TaN. It is well known that TaN has good adhesionto SiO₂-based substrates and tantalum has good adhesion to copper thatcan help to reduce copper migration along grain boundaries andstress-induced voiding. In addition, α-tantalum has a lower resistivityand helps with the formation of low-resistivity copper having a (111 )orientation in the high aspect ratio features during a dry-fillingprocess.

The inventor believes that the texture of the seed layer plays a role inthe development of the texture of the copper deposited during thedry-filling process. It is believed that a larger grain size in the seedlayer will result in a larger grain size in the deposited material. Inaddition, the inventor believes that the texture of the seed layercopper is important since the texture of the dry-filled copper will besimilar to the texture of seed layer copper. The inventor believes thatthe (111) texture is desirable.

In FIG. 1B, a simplified cross-section is shown for a substrate 105 anda feature structure 110 that can represent a trench or a via. In theillustrated embodiment, a single feature is shown, but this is forillustration purposes only.

A barrier layer 115 is shown on the top surface 106 of the substrate105, the sidewall surface 111 of the feature 110, and the bottom surface112 of the feature 110. In addition, a seed layer 120 is shown on top ofthe barrier layer 115 on the sidewall surface 111 of the feature 110,and on the bottom surface 112 of the feature 110.

In the illustrated embodiment shown in FIG. 1B, an additional portion ofmaterial 130B is shown in the lower portion of the feature. For example,the additional portion of material 130B can be deposited during a seconddry-filling process. Alternatively, the deposited amount can bedifferent and one or more dry-filling processes may be performed. Inaddition, the sidewall coverage remains uniform, the feature opening 140remains substantially unrestricted, and the overhang 135 continues to beminimized.

In FIG. 1C, a simplified cross-section of a completely filled feature115 is shown for a substrate 105 and a feature structure 110 that canrepresent a trench or a via. In the illustrated embodiment, a singlefeature is shown, but this is for illustration purposes only. A barrierlayer 115 is shown on the top surface 106 of the substrate 105, thesidewall surface 111 of the feature 110, and the bottom surface 112 ofthe feature 110.

In the illustrated embodiment shown in FIG. 1C, a third portion ofmaterial 130C is shown that fills the feature 115. For example, thethird portion of material 130C can be deposited during one or moredry-filling processes. Alternatively, the deposited amount can bedifferent and the feature can be overfilled or under-filled. During adry-filling process, the feature 115 has been filled in a bottom-upmanner without voids.

Copper can crystallize into a number of different structures. Forexample, a single copper crystal can have a face centered cubicstructure with four Cu atoms per three unit cell and a lattice parameterequal to 0.361 nm that yields a density of 8.92 g/cm. Depositedcrystalline materials such as thin films of Cu, can contain defects suchas: point defects, dislocations, grain boundaries, interfaces, voids,and inclusions, and the defects are extremely important when examiningthe quality and functionality of the thin films. For example, chemical,electrical, and mechanical properties can be altered by the presence ofdefects. In addition, the properties of crystalline materials are notisotropic but depend on a specific direction in the lattice. Forexample, in bulk materials isotropic behavior can be assumed when theindividual Cu crystals are oriented throughout a piece of bulk materialwith equal directional probability, and the material's properties can beassumed to be isotropic and can be averaged over the entire sample. Whenconsidering thin films, structure/texture can lead to non-isotropicbehavior, and structure/texture can be assumed to be the tendency of theindividual crystals of a material to assume a preferred crystallographicorientation. For example, structure/texture can affect the oxidationprocess, film resistivity, and surface energy properties.

When material is deposited using different deposition techniques thestructure/texture can be different. Material deposited in the seed layertypically has a different structure than the material deposited during adry-filling process. For example, the dry-filled copper can have largergrain sizes and larger grain boundary areas than the seed layer copper.

Typically, materials with grain boundaries try to reduce the grainboundary area using grain growth. Grain growth can be driven by forcessuch as grain boundary energy reduction, surface and interface energyreduction, and strain energy reduction. For example, smaller grain sizeleads to a larger driving force.

It is well known that copper has anisotropic mechanical characteristics.The surface energy is lowest in the (111) texture, whereas the strainenergy is lowered in the (200) texture. The inventors are continuing todevelop an understanding of grain structure evolution in the copperdeposited during the dry-filled process.

Because temperature changes occur during a dry-filling processes, thedriving forces for grain growth can be different during differentportions of the process. For example, at lower temperatures, the stressmay be low and surface energy may dominate. In this case, the depositedmaterial may prefer a texture that minimizes the surface energy, that is(111) texture. At higher temperatures, the deposited material may beunder compressive stress, and grain growth will occur to minimize thestrain energy.

The dry-filling procedures, as described herein, can be used to depositultra-thin films and/or fill nano-sized features such as trenches andvias. The features can include Damascene structures. Because of thetemperature variations during the dry-filling processes, the final grainstructures and textures of the films, lines, and vias will depend on thecritical balance between surface energy and strain energy. For example,when examining trenches and/or vias, the stress condition and surfaceenergy will be quite different due to the confinement of the trenchand/or via sidewalls. In addition, the final grain structure is animportant factor that determines long-term reliability of trenchesand/or vias.

In addition, some copper interconnections have suffered from earlyfailures that severely reduce the effective lifetime of thesemiconductor deices, and some of these failures have been attributed toelectro-migration. The grain structure/texture is known to be a factorthat affects electro-migration. For example, lines and/or vias with wellaligned (111) texture may be more resistant to electro-migration thanthose with poorly aligned or (100) texture.

Some prior art deposition methods provide incomplete and/or non-uniformdeposition in small features. For example, an incomplete and/ornon-uniform deposition may leave a void or a seam line that includesultra-small voids, and later in the fabrication processes, these voidsmay begin to grow. The inventors believe that the dry-filling proceduresdescribed herein can substantially eliminate the electro-migrationproblems by providing a bottom-up filling process that results invoid-free and seam-free material.

Copper interconnects using dual damascene structure can significantlyreduce the interconnect resistance and improve the interconnectelectro-migration performance. In general, there are three differentways to form a dual damascene structure, i.e. line first, via first, andself-align. The dry-filling procedures described herein can be used forstructures created using the three different approaches.

The present invention provides a dry-filling method for depositingcopper into nano-sized features that is better than the currently usedelectroplating (wet) techniques. For example, electroplated copper filmsare known to have “self-annealing” problems. In addition, thedry-filling process has an advantage over other conventional processessuch as physical (PVD) or chemical vapor deposition (CVD) techniques.

In the prior art processes, a CMP process is often used to remove excessmaterial after a deposition process. The CMP process can lead touniformity problems, contamination issues, and decreases in throughput.

In one embodiment, a dry-filling procedure can be performed such that aCMP process is not required.

When depositing copper into nano-sized features, the copper resistivitycan increase significantly due to increased electron scattering on grainboundaries and interfaces and the increased resistivity can decrease themove towards even smaller features. The inventor believes that thedry-filling procedures described herein will provide a means fordepositing copper having larger copper grains thereby decreasing thegrain boundaries and providing a better electron flow. In addition, theinventor believes that the dry-filling procedures described herein willprovide a means for decreasing the size of the barrier layer asnano-sized features get even smaller.

During the dry-filling process, the process is controlled to prevent theagglomeration of copper on the sidewalls as the vias and/or trenches arefilled in a bottom-up manner. Agglomeration on the sidewalls of the viasand trenches can cause discontinuities in the deposited material.

FIG. 2A illustrates an exemplary block diagram of a processing systemaccording to an embodiment of the invention. In the illustratedembodiment, an iPVD system 200A is shown.

The iPVD system 200A can comprise an iPVD processing module 210, a DCsource 205 coupled to the processing chamber 220, a process gas supplysystem 230 coupled to a processing chamber 220, a pressure controlsystem 240 coupled to the processing chamber 220, a RF source 250coupled to the processing chamber 220, an RF bias generator 255 coupledto the processing chamber 220, and a backside gas supply system 280coupled to the processing chamber 220.

The iPVD system comprises a controller 290 coupled to the processingchamber 220, coupled to the DC source 205, coupled to the gas supplysystem 230; coupled to the pressure control system 240; coupled to theRF source 250; coupled to the RF bias generator 255; and coupled to thebackside gas supply system 280.

The iPVD processing module further comprises an antenna 226, a window231 coupled to the antenna, a louvered deposition baffle 233 coupled tothe window, and a target 225 coupled to the processing chamber 220. RFpower can be supplied to the antenna 226 from the RF generator 250, andcan be used to create an inductively coupled plasma in the chamber 220.

The antenna 226 can be electrically connected using a RF matchingnetwork (not shown) to, and selectively energized or powered by, the RFgenerator 250. The RF generator 250 can provide a time-varying RFcurrent at a frequency between about 100 kHz and about 100 MHz that issupplied to the antenna 226 at a power ranging between about 100 wattsand about 10000 watts. For example, an operating frequency ofapproximately 13.56 MHz can be used. Alternately, other frequencies canbe used. When energized by the RF generator 250, the antenna 226radiates isotropic RF electromagnetic fields. A metallic outer enclosureor cage (not shown) can be used to surround the antenna to confine theradiated RF electromagnetic fields therein to ensure the safety ofnearby persons and to prevent electromagnetic interference withsurrounding electronics.

Examples of iPVD systems are described in U.S. Pat. Nos. 6,287,435;6,080,287; 6,197,165 and 6,132,564, and these patents are herebyexpressly incorporated herein by reference.

In one embodiment, a controllable backside pressure can be establishedthat allows the apparatus controller to set the relative influence ofthe backside pressure on the respective process steps differently,depending on the process parameters. This may include variable backsidepressures or flexible duty cycles.

The antenna 226 can be positioned outside of the process chamber 220behind a dielectric window 231 in the chamber wall 232. A louvereddeposition baffle 233, preferably formed of a slotted metallic material,is located inside of the chamber 220 closely spaced from the window 231to shield the window 231 from deposition. The controller 290 can be usedto determine the amount of ICP power to provide and when to have itapplied to the antenna. For example, ICP power from the RF generator 250to the antenna 226 can be switched between different power levels duringthe different steps in a deposition and/or dry-filling process.

The iPVD system 200A can also comprise a substrate holder 270 that caninclude an electrostatic chuck (not shown) and can be coupled to theprocessing chamber using a Z-motion drive 272. The Z-motion drive 272can be used to adjust the substrate-to-source distance to provide thebest deposition uniformity. The controller 290 can be used to determinethe gap size required during the dry-filling process and provide thecontrol data to the Z-motion drive 272 when it is required. During adeposition and/or dry-filling process, the substrate-to-source distancecan typically be 150 to 300 mm.

The substrate holder 270 can accommodate a 200 mm wafer, a 300 mm wafer,or a larger wafer. For example, substrate 211 can be transferred intoand out of processing chamber 220 through an opening (not shown) that iscontrolled by a gate valve assembly (not shown). In addition, substrate211 can be transferred on and off the substrate holder 270 using arobotic substrate transfer system (not shown). In addition, substrate211 can be received by substrate lift pins (not shown) housed withinsubstrate holder 270 and mechanically translated by devices housedtherein. Once the substrate 211 is received from the transfer system, itcan be lowered to an upper surface of the substrate holder 270.

During processing, a substrate 211 can be held in place on top of thesubstrate holder 270 using an electrostatic chuck (not shown).Alternately, an electrostatic chuck may not be required. In addition,the substrate temperature can be controlled when the substrate is on thesubstrate holder 270. For example, heating and/or cooling elements (notshown) can be used along with one or more backside gasses. Thetemperature of the substrate 211 can be controlled to obtain the bestvia metallization. The controller 290 can be used to determine andcontrol the substrate temperature. In addition, substrate temperaturecan be controlled by providing the substrate holder 270 with temperaturecontrolling fluid passages (not shown) and the appropriate temperaturecontrols. The thermal conductivity between the substrate holder 270 andthe substrate 211 can be controlled by providing backside gas betweenthe substrate 211 and the substrate holder 270. Process parameters canbe controlled during the deposition and/or dry-filling steps to ensurethat the metal deposited in the via structures is uniform and notagglomerated. For example, heat generated in the substrate 211 duringplasma processing can be extracted efficiently by the substrate holder270 to keep the temperature of the substrate 211 at a substantiallyconstant temperature, or the heat can be used to increase the substratetemperature.

RF bias power can be supplied to the substrate holder 270 using the RFbias generator 255, and can be used to provide a substrate bias. Thecontroller 290 can be used to determine the amount of RF bias power toprovide and when to have it applied to the substrate holder 270. Forexample, RF bias power can be turned on to a level appropriate duringdeposition and/or dry-filling processes to control the bias on thesubstrate 211 to improve and affect the process.

The operating frequency for the RF bias generator 255 can range from 1MHz to 100 MHz. The RF bias generator 255 can be used to selectivelyapply a bias potential that accelerates positively charged plasmacomponents toward the substrate. The bias potential provided by the RFbias generator 255 substantially determines the kinetic energies ofpositive ions attracted to the substrate from the plasma. The RF biasgenerator 255 typically operates at a frequency of about 13.56 MHz andat a power between about 100 watts and about 1000 watts. Alternately,the RF bias generator 255 may be omitted from the processing system andthe substrate table may be either grounded or electrically floating.Alternately, other frequencies can be used, such as 2 MHz or 27 MHz.

Process gas can be provided to the processing chamber 220 by the gassupply system 230. The process gas can comprise a metal-containing gas,an inert gas, or a combination thereof. The inert gas may be argon,which is often used, but may also be any other inert gas or may be anon-inert gas that is compatible with the process.

Chamber pressure can be controlled using the pressure control system240. In addition, process gas can be supplied into the vacuum processingchamber 220 by the gas supply system 230. The chamber pressure can bemaintained at a vacuum by the pressure control system 240. Thecontroller 290 can be used to control the flow rate and chemistry forthe process gas, and to control the chamber pressure accordingly.

DC power can be supplied from a power source 205 to the target 225. Thecontroller 290 can be used to determine the amount of DC power toprovide and when to have it applied to the target. For example, during aDC-on cycle, the DC power to the target 225 can be controlled to producea substantially uniform deposition and/or dry-filling process, andduring a shaping plasma process (controlled DC process), the DC power tothe target 225 can be reduced or turned off to shape the size of thefeature openings and/or substantially reduce or stop a deposition and/ordry-filling process. In some cases, a shaping plasma process may beperformed by reducing the DC power level to a very low level withoutcompletely turning it off. In addition, the amount of the overhangingmaterial around the feature openings can be reduced during a shapingplasma process by controlling the ICP power level and the RF bias powerlevel. For example, an inert gas plasma can be used as the shapingplasma. Furthermore, by adjusting (lowering) the RF bias power whilemaintaining a substantially constant ICP power, the ion bombardment canbe adjusted to a level below the etch threshold and this can increasethe surface mobility of copper on the sidewall and corner.

The controller 290 can be configured to provide control data to thesystem components and receive process and/or status data from the systemcomponents. For example, the controller 290 can comprise amicroprocessor, a memory (e.g., volatile or non-volatile memory), and adigital I/O port capable of generating control voltages sufficient tocommunicate and activate inputs to the iPVD system 200A as well asmonitor outputs from the iPVD system 200A. Moreover, the controller 290can exchange information with the system components, and a programstored in the memory can be utilized to control the aforementionedcomponents of an iPVD system 200A according to a process recipe. Inaddition, the controller 290 can be configured to analyze the processand/or status data, to compare the process and/or status data withdesired process and/or status data, and to use the comparison to changea process and/or control a system component. In addition, the controllercan be configured to analyze the process and/or status data, to comparethe process and/or status data with historical process and/or statusdata, and to use the comparison to predict, prevent, and/or declare afault.

FIG. 2B illustrates an exemplary block diagram of a processing systemaccording to an alternate embodiment of the invention. In theillustrated embodiment, an iPVD system 200B is shown.

The iPVD system 200B can comprise an iPVD processing module 210, a DCsource 205 coupled to the processing chamber 220, a process gas supplysystem 230 coupled to a processing chamber 220, a magnet assembly 235coupled to the processing chamber 220, a pressure control system 240coupled to the processing chamber 220, a RF source 250 coupled to theprocessing chamber 220, an RF bias generator 255 coupled to theprocessing chamber 220, and a backside gas supply system 280 coupled tothe processing chamber 220.

The iPVD system 200B comprises a controller 290 coupled to theprocessing chamber 220, coupled to the DC source 205, coupled to the gassupply system 230, coupled to the magnet assembly 235, coupled to thepressure control system 240, coupled to the RF source 250, coupled tothe RF bias generator 255, and coupled to the backside gas supply system280.

The iPVD processing module 210 further comprises an antenna 226, awindow 231 coupled to the antenna, a louvered deposition baffle 233coupled to the window, a target 225 coupled to the processing chamber220, and a magnet assembly 235 coupled to the processing chamber 220. RFpower can be supplied to the antenna 226 from the RF generator 250, andcan be used to create an inductively coupled plasma in the chamber 220.

The antenna 226 can be electrically connected using a RF matchingnetwork (not shown) to, and selectively energized or powered by, the RFgenerator 250. The RF generator 250 can provide a time-varying RFcurrent at a frequency between about 100 kHz and about 100 MHz that issupplied to the antenna 226 at a power ranging between about 100 wattsand about 10000 watts. For example, an operating frequency ofapproximately 13.56 MHz can be used. Alternately, other frequencies canbe used. When energized by the RF generator 250, the antenna 226radiates isotropic RF electromagnetic fields. A metallic outer enclosureor cage (not shown) can be used to surround the antenna to confine theradiated RF electromagnetic fields therein to ensure the safety ofnearby persons and to prevent electromagnetic interference withsurrounding electronics.

Examples of apparatus having reduced and controllable magnetic fieldsare described in U.S. Patent Application Publication No. 20040188239,and this patent application is incorporated herein by reference.

The antenna 226 can be positioned outside of the process chamber 220behind a dielectric window 231 in the chamber wall 232. A louvereddeposition baffle 233, preferably formed of a slotted metallic material,is located inside of the chamber 220 closely spaced from the window 231to shield the window 231 from deposition. The controller 290 can be usedto determine the amount of ICP power to provide and when to have itapplied to the antenna. For example, ICP power from the RF generator 250to the antenna 226 can be switched between different power levels duringthe different steps in a deposition process.

The iPVD system 200B can also comprise a substrate holder 270 that caninclude an electrostatic chuck (not shown) and can be coupled to theprocessing chamber using a Z-motion drive 272. The Z-motion drive 272can be used to adjust the substrate-to-source distance to provide thebest deposition uniformity. The controller 290 can be used to determinethe gap size required during the deposition process and provide thecontrol data to the Z-motion drive 272 when it is required. During adeposition and/or dry-filling process, the substrate-to-source distancecan typically be 150 to 300 mm.

The substrate holder 270 can accommodate a 200 mm wafer, a 300 mm wafer,or a larger wafer. For example, substrate 211 can be transferred intoand out of processing chamber 220 through an opening (not shown) that iscontrolled by a gate valve assembly (not shown). In addition, substrate211 can be transferred on and off the substrate holder 270 using arobotic substrate transfer system (not shown). In addition, substrate211 can be received by substrate lift pins (not shown) housed withinsubstrate holder 270 and mechanically translated by devices housedtherein. Once the substrate 211 is received from the transfer system, itcan be lowered to an upper surface of the substrate holder 270.

During processing, a substrate 211 can be held in place on top of thesubstrate holder 270 using an electrostatic chuck (not shown).Alternately, an electrostatic chuck may not be required. In addition,the substrate temperature can be controlled when the substrate is on thesubstrate holder 270. For example, heating and/or cooling elements (notshown) can be used along with one or more backside gasses. Thetemperature of the substrate 211 can be controlled to obtain the bestvia metallization. The controller 290 can be used to determine andcontrol the substrate temperature. In addition, substrate temperaturecan be controlled by providing the substrate holder 270 with temperaturecontrolling fluid passages (not shown) and the appropriate temperaturecontrols. Good thermal contact between the substrate holder 270 and thesubstrate 211 can be achieved by providing backside gas conductionbetween the substrate 211 and the substrate holder 270. Processparameters can be controlled during the deposition and/or dry-fillingsteps to ensure that the metal deposited in the via structures isuniform and not agglomerated.

RF bias power can be supplied to the substrate holder 270 using the RFbias generator 255, and can be used to provide a substrate bias. Thecontroller 290 can be used to determine the amount of RF bias power toprovide and when to have it applied to the substrate holder 270. Forexample, RF bias power can be turned on to a level appropriate duringdeposition and/or dry-filling processes to control the bias on thesubstrate 211 to improve and affect the process.

The operating frequency for the RF bias generator 255 can range from 1MHz to 100 MHz. The RF bias generator 255 can be used to selectivelyapply a bias potential that accelerates positively charged plasmacomponents toward the substrate. The bias potential provided by the RFbias generator 255 substantially determines the kinetic energies ofpositive ions attracted to the substrate from the plasma. The RF biasgenerator 255 typically operates at a frequency of about 13.56 MHz andat a power between about 100 watts and about 1000 watts. Alternately,the RF bias generator 255 may be omitted from the processing system andthe substrate table may be either grounded or electrically floating.Alternately, other frequencies can be used, such as 2 MHz or 27 MHz.

Process gas can be provided to the processing chamber 220 by the gassupply system 230. The process gas can comprise a metal-containing gas,an inert gas, or a combination thereof. The inert gas may be argon,which is often used, but may also be any other inert gas or may be anon-inert gas that is compatible with the process.

Chamber pressure can be controlled using the pressure control system240. In addition, process gas can be supplied into the vacuum processingchamber 220 by the gas supply system 230. The chamber pressure can bemaintained at a vacuum by the pressure control system 240. Thecontroller 290 can be used to control the flow rate and chemistry forthe process gas, and to control the chamber pressure accordingly.

DC power can be supplied from a power source 205 to the target 225. Thecontroller 290 can be used to determine the amount of DC power toprovide and when to have it applied to the target. For example, during aDC-on cycle, the DC power to the target 225 can be controlled to producea substantially uniform deposition and/or dry-filling process, andduring a shaping plasma process, the DC power to the target 225 can bereduced or turned off to shape the size of the feature openings and/orsubstantially reduce or stop a deposition and/or dry-filling process. Insome cases, a shaping plasma process may be performed by reducing the DCpower level to a very low level without completely turning it off. Inaddition, the amount of the overhanging material around the featureopenings can be reduced during a shaping plasma process by controllingthe ICP power level and the RF bias power level. For example, an inertgas plasma can be used as the shaping plasma. Furthermore, by adjusting(lowering) the RF bias power while maintaining a substantially constantICP power, the ion bombardment can be adjusted to a level below the etchthreshold and this can increase the surface mobility of copper onsidewall and corner.

The controller 290 can be configured to provide control data to thesystem components and receive process and/or status data from the systemcomponents. For example, the controller 290 can comprise amicroprocessor, a memory (e.g., volatile or non-volatile memory), and adigital I/O port capable of generating control voltages sufficient tocommunicate and activate inputs to the iPVD system 200B as well asmonitor outputs from the iPVD system 200B. Moreover, the controller 290can exchange information with the system components, and a programstored in the memory can be utilized to control the aforementionedcomponents of an iPVD system 200B according to a process recipe. Inaddition, the controller 290 can be configured to analyze the processand/or status data, to compare the process and/or status data withdesired process and/or status data, and to use the comparison to changea process and/or control a system component. In addition, the controllercan be configured to analyze the process and/or status data, to comparethe process and/or status data with historical process and/or statusdata, and to use the comparison to predict, prevent, and/or declare afault.

FIG. 3 illustrates a simplified block diagram of a substrate holder inaccordance with an embodiment of the invention. In the illustratedembodiment, a substrate holder with an electrostatic chuck is shown, butthis is not required for the invention. In an alternate embodiment, anelectrostatic chuck may not be required.

With reference to FIG. 3, the substrate holder 270 includes a dielectricbody 338 having a support surface 340 that receives the substrate 211.The dielectric body 338 can be fabricated of a ceramic material, such asan aluminum nitride, that has a high electrical resistivity and asuitable thermal conductivity. Alternately, other material may be used.

In one embodiment, a disk-shaped inner electrode 342 and an annularouter electrode 344 that encircles the inner electrode 342 can beembedded within the dielectric body 338. The outer electrode 344 issubstantially concentric with the inner electrode 342 and each of theelectrodes 342, 344 is formed of a metal such as molybdenum. The innerelectrode 342 is electrically isolated from the outer electrode 344, sothat electrodes 342, 344 can serve as opposite poles when theelectrostatic chuck 345 operates in a bipolar configuration.Alternately, a single element electrode may be used.

The outputs of a variable, high-voltage power supply 346 can beelectrically coupled via shielded transmission lines 348, 349 to theelectrodes 342, 344 to provide a DC bias potential or clamping voltage.In some embodiments, the high-voltage power supply 346 can be cabledsuch that the inner electrode 342 is positively biased and the outerelectrode 344 is negatively biased. The oppositely-charged inner andouter electrodes 342, 344 establishes a potential difference between thesubstrate 211 and the electrodes 342, 344 that electrostatically securesthe substrate 211 to the support surface 340 with a clamping forceproportional to the characteristics of the electrostatic chuck 345 andthe applied clamping voltage. The high-voltage power supply 346 isoperable to supply a clamping voltage between about negative 1500 Voltsand about positive 1500 Volts. Alternately, the variable, high-voltagepower supply 346 may be electrically coupled in a different manner.

Although electrostatic chuck 345 is illustrated in FIG. 3 as a bipolarchuck and the discussion below describes the present invention in thecontext of a bipolar chuck of a Johnsen-Rahbek design, the presentinvention is not so limited and may use electrostatic chucks withalternative electrode structures, such as monopolar chucks of aJohnsen-Rahbek design and Coulombic chucks. For example, conventionalJohnsen-Rahbek chucks are illustrated in U.S. Pat. Nos. 6,134,096 and5,946,183, and these patents are hereby incorporated by reference hereinin their entirety.

A RF power supply 255 is electrically coupled via a shieldedtransmission line 351 to the electrode 355 to provide a time-dependentbias. The time dependent DC bias attracts ions and radicals from theplasma to the exposed surface of the substrate. The RF power supply 255typically operates at a frequency of about 13.56 MHz and a power levelof less than about 1500 watts, typically about 100 watts. The RF powersupply 255 can operated at one or more different levels during theprocess steps to provide a net negative bias on the substrate 211 toimprove and affect the process. For example, the net negative bias canvary from zero volts to several hundred volts.

In one embodiment, the substrate holder 270 can include temperaturecontrol elements 335 and the temperature control elements 335 can becoupled 331 to a temperature control unit 330. The temperature controlelements 335 can be embedded within the dielectric body 338. In oneexample, the temperature control elements 335 can comprise one or moreresistive heating element, having the form of a grid mesh, electricallyconnected 331 to the temperature control unit 330. The temperaturecontrol elements 335 can be electrically isolated from the electrodes342, 344, and other portions of the substrate holder 270, by theintervening thicknesses of the dielectric material of the dielectricbody 338. In addition, the temperature control elements 335 can compriseone or more cooling elements (not shown). In another example, thetemperature control elements 335 can include one or more fluidpassageways for providing heating and/or cooling fluid to control thetemperature of the substrate holder 270. Thermal energy can betransferred to and from temperature control elements 335 through thedielectric body 338 to the support surface 340 and to substrate 211positioned on the support surface 340. The temperature of the substrate211 is regulated by varying the temperature of one or more of thetemperature control elements 335. Typically, the substrate 211 is heldat a specific predetermined temperature during a process step, and thetemperature is controlled to ensure a uniform process across the entiresubstrate 211.

In the illustrated embodiment, two gas passageways 356 are shown, butthis is not required for the invention. Alternately, a different numberof gas passageways may be provided. In FIG. 3, two gas passageways 356are shown that extend through the dielectric body 338 to communicate atone end with a network of interconnected gas channels 358 on the surfaceof the dielectric body 338. Gas channels 358 direct a backside (heattransfer) gas, such as helium or argon, between the support surface 340and the facing surface of the substrate 211. The other end of each gaspassageway 356 communicates with gas lines 358 leading to a backside gassupply system 280. In an alternate embodiment, a multi-zone gasdistribution system may be used to independently control the backsidepressure in different portions of the substrate. For example, differentand independent backside pressure values may be established for thecenter portion and the edge portion.

The presence of the backside gas promotes the uniform and efficienttransfer of heat energy between portions of the support surface 340 andthe substrate 211 that are not in actual physical contact by providingan efficient heat transfer medium. To optimize the transfer of heatbetween the substrate 211 and support surface 340, the electrostaticforce can be made approximately uniform to cause a significant portionof the facing surface of the substrate 211 to physically contact thesupport surface 340 and to contact the surface 340 with a substantiallyuniform force. The significant physical contact between support surface340 and substrate 211 also limits the leakage of heat transfer gas frombeneath the substrate 211 to maintain a suitable heat transfer gaspressure and improves the transfer of heat therebetween.

One or more temperature sensors 385 can be positioned at one or morelocations on or within the dielectric body 338 and can be coupled to acontroller 290 that converts signals from the temperature sensors 385 toprovide an indication of the temperature of the dielectric body 338. Thetemperature of the dielectric body 338 can be used to approximate thetemperature of the substrate 211 and the controller 290 can providefeedback information to the temperature control unit 330 and the heattransfer gas supply system 280 for regulating the temperature ofsubstrate 211.

The backside gas can be supplied at a pressure in a range fromapproximately one Torr to approximately ten Torr, which can result in aforce due to the pressure differential between the gas pressure and thepressure within the vacuum processing chamber 220 which, as mentionedabove, is between about 5 mTorr and about 30 mTorr. The force applied bythe backside gas acts to displace the substrate 211 from the supportsurface 340. To counteract this force, a clamping voltage can be appliedto the electrodes 342, 344 of the electrostatic chuck 345 to establishan attractive electrostatic force of a magnitude sufficient to securethe substrate 211 to the support surface 340.

In one embodiment, one or more process parameters can be measured andcompared with desired process parameters to control the operation of oneor more components of the iPVD system. The measured performance can beused to alter one or more process parameters, such as a DC-on time, ashaping plasma process time, a DC-off time, a DC power, a backsidepressure, substrate temperature, etc.

The controller 290 can be used to determine the amount of backsidepressure to provide and when to have it applied to the substrate. Forexample, backside pressure can be switched between different levelsduring a dry-filling and/or deposition process. In addition, thermalconductance between the substrate holder 270 and the substrate 211 canbe controlled by providing backside gas between the substrate 211 andthe substrate holder 270. For example, backside pressure and/or otherprocess parameters may be controlled during a dry-filling step to ensurethat the metal deposition within the features is uniform and notagglomerated. In addition, the performance of the electrostatic chuck345 may be controlled to compensate for changes in the backsidepressure.

FIG. 4 illustrates a simplified flow diagram of a method of operating adeposition system to perform a process in accordance with an embodimentof the invention. In the illustrated embodiment, a dry-filling processis shown. In alternate embodiments, other procedures can be performedthat may include one or more NND processes, one or more LND processes,and various combinations of LND processes and NND processes. Procedure400 starts in 410.

In 415, a patterned substrate/wafer can be positioned on a substrateholder and clamped using an electrostatic chuck in a processing chamberas described herein. Alternately, an electrostatic chuck may not berequired. For example, the processing chamber can be an iPVD chamber.

In one embodiment, the substrate holder can be vertically translated toestablish the required gap between the target and the substrate.Alternately, the gap can be established at a different time or the gapcan be changed. For example, the gap may be changed when plasma is notpresent. The gap size can range from approximately 100 mm to 400 mm.Alternatively, the gap can range from approximately 200 mm to 300 mm.

In 420, a first backside pressure can be established by flowing abackside gas to the backside of the patterned substrate. In oneembodiment, a single zone technique can be used. Alternatively, amulti-zone technique may be used. For example, different backsidepressures may be established for the center and edge regions.

The thermal conductivity between the substrate holder 270 and thesubstrate 211 can be varied by controlling the backside pressureestablished between the substrate 211 and the substrate holder 270. Inaddition, the backside pressure can be controlled during the depositionand/or dry-filling steps to ensure a uniform fill.

In one embodiment, the backside pressure is varied. so that thetemperature of the substrate 211 is maintained at an operatingtemperature substantially below room temperature at the start of theprocessing. For example, the operating temperature at the start of theprocess can be approximately −30° Celsius. Alternatively, a differentstarting temperature range may be used.

In 425, a first dry-filling process can be performed. During a firstdry-filling process time, a first portion of metal is deposited into atleast one feature of the patterned substrate. A first high densityplasma can be created during a first dry-filling process time. The firsthigh density plasma can be created using a first process gas that can beflowed into the processing chamber using a gas supply system coupled tothe processing chamber. In one embodiment, the first process gas cancomprise an inert gas. The inert gas can comprise argon, helium,krypton, radon, xenon, or a combination thereof. Alternatively, thefirst process gas can comprise an inert gas, a nitrogen-containing gas,an oxygen-containing gas, a metal-containing gas, or a combinationthereof. The nitrogen-containing gas can comprise N₂, NO, N₂O, and NH₃,and the oxygen-containing gas can comprise O₂, NO, N₂O, and H₂O. Themetal-containing gas comprises copper (Cu), tantalum (Ta), titanium,(Ti), ruthenium (Ru), iridium (Ir), aluminum (Al), silver (Ag), platinum(Pt), or a combination thereof.

A first ICP power level can be provided by an ICP source operating at afirst ICP frequency when creating the first high density plasma. The ICPsource can be coupled to an antenna coupled to the processing chamber.The ICP source can be an RF generator, and the ICP source can operate ina frequency range from approximately 1.0 MHz to approximately 100 MHz.Alternatively, the frequency may range from approximately 10 MHz toapproximately 30 MHz. For example, the ICP frequency can beapproximately 13.5 MHz, or approximately 27 MHz.

The ICP power can range from approximately 1000 watts to approximately6000 watts. Alternatively, the ICP power may range from approximately4500 watts to approximately 5500 watts. For example, the ICP power canbe approximately 5250 watts.

In addition, a first RF bias power level can be provided by a RF biassource operating at a first RF bias frequency when creating the firsthigh density plasma. The RF bias source can be coupled to the substrateholder in the processing chamber.

The RF bias source can be an RF generator, and the RF bias source canoperate in a frequency range from approximately 1.0 MHz to approximately100 MHz. Alternatively, the frequency may range from approximately 10MHz to approximately 30 MHz. For example, the RF bias frequency can beapproximately 13.5 MHz, or approximately 27 MHz.

The RF bias power can range from approximately 100 watts toapproximately 1000 watts. Alternatively, the RF bias power may rangefrom approximately 200 watts to approximately 400 watts.

Furthermore, a first DC (target) power level can be provided by a DCsource coupled to the metallic target while creating the first highdensity plasma. Alternatively, a target power is not required to createthe first high density plasma. The DC power provided by the DC sourcecan range from 0 watts to approximately 6000 watts. Alternatively, theDC power may range from 0 watts to approximately 2000 watts. In oneembodiment, the target can include copper (Cu). Alternatively, thetarget may comprise copper (Cu), tantalum (Ta), titanium, (Ti),ruthenium (Ru), iridium (Ir), aluminum (Al), silver (Ag), platinum (Pt),or a combination thereof.

For example, one high density plasma can be created during a DC-on cycleby providing substantially simultaneously a RF bias power to theelectrostatic chuck and a target power to the target, and another highdensity plasma can be created during a shaping plasma process bycontrolling the amount of DC/target power provided to the target.

In one embodiment, the backside pressure is maintained at asubstantially constant value so that the heat generated in the substrate211 during plasma processing can be efficiently extracted by thesubstrate holder 270. The backside pressure can be controlled to keepthe temperature of the substrate 211 at an operating temperaturesubstantially below room temperature during the first dry-fillingprocess. For example, the backside pressure during the first dry-fillingprocess can be between approximately 5 Torr and approximately 10 Torr.Alternatively, a different backside pressure range may be used. In otherembodiments, the backside pressure may be changed during the firstdry-filling process. For example, the backside pressure may be stepped,pulsed, cycled, and/or linearly changed during the first dry-fillingprocess.

When the first dry-filling process is performed using the first highdensity plasma, a first thickness of metal is deposited onto the fieldarea of the patterned substrate and a second thickness of metal isdeposited into the bottom portion of at least one feature of thepatterned substrate. In the present invention, the controller canestablish the process parameters required to minimize the fielddeposition while maximizing the bottom fill and preventing the formationof voids. For example, the controller can simultaneously control thetarget power, the RF bias power, the ICP power, the backside pressure,the chamber pressure, the substrate temperature, the process chemistry,or the process time, or a combination thereof to provide a dry-fillingprocess that causes a substantially uniform deposition into the featuresof the substrate.

In addition, the first high density plasma can be extinguished for afirst shutdown period after the first dry-filling process has beenperformed. The first shutdown period can range from 0 seconds toapproximately 100 seconds. Alternatively, the first shutdown period canrange from approximately 4 seconds to approximately 20 seconds. Duringthe first shutdown period, the substrate temperature can change. Forexample, the substrate temperature can decrease when the plasma isextinguished.

In various embodiments, the first dry-filling process may include anumber of fill cycles and a number of off-cycles, and a dry-fillingprocess may be repeated a number of times (1-30) to obtain the requiredfill amount. For example, a dry-filling process may include durationtimes lasting from 1-1500 seconds for the fill cycles and/or theoff-cycles. For example, a NND process can be performed during the firstdry-filling process time; the first NND process can have a first fillrate; and the first fill rate can range from 0 nm/min to approximately+15 nm/min.

In 430, a query can be performed to determine when to perform anadditional first dry-filling process. When an additional firstdry-filling process is required, procedure 400 can branch back to 420and proceed as shown in FIG. 4. When an additional first dry-fillingprocess is not required, procedure 400 can branch to 435 and proceed asshown in FIG. 4. In one embodiment, one or more process parameters canbe changed when the additional first dry-filling process is performed.For example, the backside pressure may be between zero Torr andapproximately five Torr. In one embodiment, a process time can be usedto determine when to perform an additional first dry-filling process.Alternatively, optical techniques may be used to determine thicknesses.

In 435, a second backside pressure can be established by providing thebackside gas to the backside of the patterned substrate. In oneembodiment, a single zone technique can be used. Alternatively, amulti-zone technique may be used. The thermal conductivity between thesubstrate holder 270 and the substrate 211 can be varied by controllingthe backside pressure established between the substrate 211 and thesubstrate holder 270. For example, the second backside pressure may belower than the first backside pressure causing the substrate temperatureto increase. In another embodiment, the temperature of the substrateholder can be changed to change and/or help change the substratetemperature.

In 440, a second dry-filling process can be performed. During a seconddry-filling process time, a second portion of metal is deposited into atleast one feature of the patterned substrate. In addition, during thesecond dry-filling process time, a second high density plasma can becreated.

A second high density plasma can be created during a second dry-fillingprocess time. The second high density plasma can be created using asecond process gas that can be flowed into the processing chamber usinga gas supply system coupled to the processing chamber. In oneembodiment, the second process gas can comprise an inert gas. The inertgas can comprise argon, helium, krypton, radon, xenon, or a combinationthereof. Alternatively, the second process gas can comprise an inertgas, a nitrogen-containing gas, an oxygen-containing gas, ametal-containing gas, or a combination thereof. The nitrogen-containinggas can comprise N₂, NO, N₂O, and NH₃, and the oxygen-containing gas cancomprise O₂, NO, N₂O, and H₂O. The metal-containing gas comprises copper(Cu), tantalum (Ta), titanium, (Ti), ruthenium (Ru), iridium (Ir),aluminum (Al), silver (Ag), platinum (Pt), or a combination thereof.

A second ICP power level can be provided by an ICP source operating at asecond ICP frequency when creating the second high density plasma. TheICP source can be coupled to an antenna coupled to the processingchamber. The ICP source can be an RF generator, and the ICP source canoperate in a frequency range from approximately 1.0 MHz to approximately100 MHz. Alternatively, the frequency may range from approximately 10MHz to approximately 30 MHz. For example, the ICP frequency can beapproximately 13.5 MHz, or approximately 27 MHz.

The second ICP power can range from approximately 1000 watts toapproximately 6000 watts. Alternatively, the second ICP power may rangefrom approximately 4500 watts to approximately 5500 watts. For example,the ICP power can be approximately 5250 watts.

In addition, a second RF bias power level can be provided by a RF biassource operating at a second RF bias frequency when creating the secondhigh density plasma. The RF bias source can be coupled to the substrateholder in the processing chamber.

The RF bias source can be an RF generator, and the RF bias source canoperate in a frequency range from approximately 1.0 MHz to approximately100 MHz. Alternatively, the frequency may range from approximately 10MHz to approximately 30 MHz. For example, the RF bias frequency can beapproximately 13.5 MHz, or approximately 27 MHz.

The second RF bias power can range from approximately 100 watts toapproximately 1000 watts. Alternatively, the RF bias power may rangefrom approximately 200 watts to approximately 400 watts.

Furthermore, a second DC power level can be provided by a DC sourcecoupled to the metallic target while creating the second high densityplasma. The second DC power provided by the DC source can range from 0watts to approximately 6000 watts. Alternatively, the second DC powermay range from 0 watts to approximately 2000 watts. In one embodiment,the target can include copper (Cu). Alternatively, the target maycomprise copper (Cu), tantalum (Ta), titanium, (Ti), ruthenium (Ru),iridium (Ir), aluminum (Al), silver (Ag), platinum (Pt), or acombination thereof.

In one embodiment, the backside pressure is controlled so that the heatgenerated in the substrate 211 during plasma processing can be used toincrease the substrate temperature. The backside pressure can be cycledso that the temperature of the substrate 211 increases from a startingtemperature below approximately −10° Celsius to a temperature aboveapproximately 100° Celsius during processing. Alternatively, a differenttemperature range may be used. In another embodiment, the backsidepressure may be controlled to maintain and/or decrease the substratetemperature. In another embodiment, the temperature of the substrateholder can be changed to change and/or help change the substratetemperature.

For example, the backside pressure during the second dry-filling processcan be maintained at a value between zero Torr and approximately fiveTorr. Alternatively, a different backside pressure range may be used. Inother embodiments, the backside pressure may be changed during thesecond dry-filling process. For example, the backside pressure may bestepped, pulsed, cycled, and/or linearly changed during the seconddry-filling process.

When the second dry-filling process is performed using the second highdensity plasma, an additional thickness of metal is deposited onto thefield area of the patterned substrate and an additional thickness ofmetal is deposited into the features of the patterned substrate. In thepresent invention, the controller can establish the process parametersrequired to maximize the filling of the features, while preventing theformation of voids, minimizing the field deposition, and optimizing thesize of the opening at the top of the features.

In one embodiment, the target power can be changed during the seconddry-filling process. The second dry-filling process can include one ormore DC-on cycles and one or more shaping plasma processes.

In one embodiment, the second high density plasma can be extinguishedfor a second shutdown period after the second dry-filling process hasbeen performed. The second shutdown period can range from approximately1 second to approximately 100 seconds. Alternatively, the secondshutdown period can range from approximately 4 seconds to approximately20 seconds. During the second shutdown period, the substrate temperaturecan change. For example, the substrate temperature can decrease when theplasma is extinguished. In other embodiments, a shutdown period may notbe required during every cycle.

In various embodiments, the second dry-filling process may include anumber of DC-on cycles, a number of shaping plasma processes, and anumber of plasma off-cycles, and the second dry-filling process may berepeated a number of times (1-30) to obtain the required fill amount.For example, a dry-filling process may include process times lastingfrom 1-1500 seconds for the dry-filling processes, the shaping plasmaprocesses, and/or the off-cycles. For example, a NND process can beperformed during the second dry-filling process time; the second NNDprocess can have a second fill rate; and the second fill rate can rangefrom approximately +2 nm/min to approximately +25 nm/min.

In 445, a query can be performed to determine when to perform anadditional second dry-filling process. When an additional seconddry-filling process is not required, procedure 400 can branch to 450 andproceed as shown in FIG. 4. When an additional second dry-fillingprocess is required, procedure 400 can branch back to 435. In oneembodiment, one or more process parameters can be changed when theadditional second dry-filling process is performed. For example, thebackside pressure may be between zero Torr and approximately five Torr.In one embodiment, a process time can be used to determine when toperform an additional second dry-filling process. Alternatively, opticaltechniques may be used to determine thicknesses

In 450, a query can be performed to determine when to perform anadditional process. When an additional process is required, procedure400 can branch to 455 and proceed as shown in FIG. 4. When an additionalprocess is not required, procedure 400 can end in 460.

In 455, an additional process can be performed. In one embodiment, athird dry-filling process can be performed using a different substratetemperature. For example, lower power plasma conditions and a highersubstrate temperature can be used. During a third dry-filling processtime, a third portion of metal can be deposited into the features of thepatterned substrate.

A third high density plasma can be created during a third dry-fillingprocess time. The third high density plasma can be created using a thirdprocess gas that can be flowed into the processing chamber using a gassupply system coupled to the processing chamber. In one embodiment, thethird process gas can comprise an inert gas. The inert gas can compriseargon, helium, krypton, radon, xenon, or a combination thereof.Alternatively, the third process gas can comprise an inert gas, anitrogen-containing gas, an oxygen-containing gas, a metal-containinggas, or a combination thereof. The nitrogen-containing gas can compriseN₂, NO, N₂O, and NH₃, and the oxygen-containing gas can comprise O₂, NO,N₂O, and H₂O. The metal-containing gas comprises copper (Cu), tantalum(Ta), titanium, (Ti), ruthenium (Ru), iridium (Ir), aluminum (Al),silver (Ag), platinum (Pt), or a combination thereof.

A third ICP power level can be provided by the ICP source operating at athird ICP frequency when creating the third high density plasma. The ICPsource can be an RF generator, and the ICP source can operate in afrequency range from approximately 1.0 MHz to approximately 100 MHz.Alternatively, the frequency may range from approximately 10 MHz toapproximately 30 MHz. For example, the ICP frequency can beapproximately 13.5 MHz, or approximately 27 MHz.

The third ICP power can range from approximately 1000 watts toapproximately 600 watts. Alternatively, the third ICP power may rangefrom approximately 4500 watts to approximately 5500 watts. For example,the ICP power can be approximately 5250 watts.

In addition, a third RF bias power level can be provided by a RF biassource operating at a third RF bias frequency when creating the thirdhigh density plasma. The RF bias source can be coupled to the substrateholder in the processing chamber.

The RF bias source can be an RF generator, and the RF bias source canoperate in a frequency range from approximately 1.0 MHz to approximately100 MHz. Alternatively, the frequency may range from approximately 10MHz to approximately 30 MHz. For example, the RF bias frequency can beapproximately 13.5 MHz, or approximately 27 MHz.

The third RF bias power can range from approximately 100 watts toapproximately 1000 watts. Alternatively, the third RF bias power mayrange from approximately 200 watts to approximately 400 watts.

Furthermore, a third DC power level can be provided by a DC sourcecoupled to the metallic target while creating the third high densityplasma. The third DC power provided by the DC source can range from 0watts to approximately 600 watts. Alternatively, the third DC power mayrange from 0 watts to approximately 2000 watts. In one embodiment, thetarget can include copper (Cu). Alternatively, the target may comprisecopper (Cu), tantalum (Ta), titanium, (Ti), ruthenium (Ru), iridium(Ir), aluminum (Al), silver (Ag), platinum (Pt), or a combinationthereof.

In one embodiment, the backside pressure is controlled so that the heatgenerated in the substrate 211 during plasma processing can be used toincrease the substrate temperature. The backside pressure can be cycledso that the temperature of the substrate 211 increases from a startingtemperature below approximately 20° Celsius to a temperature aboveapproximately 150° Celsius during processing. Alternatively, a differenttemperature range may be used. In another embodiment, the backsidepressure may be controlled to maintain and/or decrease the substratetemperature. In another embodiment, the temperature of the substrateholder can be changed to change and/or help change the substratetemperature.

For example, the backside pressure during the third dry-filling processcan be maintained at a value between zero Torr and approximately twoTorr. Alternatively, a different backside pressure range may be used. Inother embodiments, the backside pressure may be changed during the thirddry-filling process. For example, the backside pressure may be stepped,pulsed, cycled, and/or linearly changed during the third dry-fillingprocess.

When the third dry-filling process is performed using the third highdensity plasma, an additional thickness of metal is deposited onto thefield area of the patterned substrate and an additional thickness ofmetal is deposited into the features of the patterned substrate. In thepresent invention, the controller can establish the process parametersrequired to minimize the field deposition while maximizing the featurefill and increasing the surface mobility of the deposited metal in thefeatures. For example, the controller can simultaneously control thetarget (DC) power, the RF bias power, the ICP power, the backsidepressure, the chamber pressure, the substrate temperature, the processchemistry, or the process time, or a combination thereof to provide asecond dry-filling process that causes a substantially small amount ofnet deposition to occur in the field area of the substrate.

In one embodiment, the target power and the RF bias power can be changedduring the third dry-filling process. The third dry-filling process caninclude one or more DC-on cycles and one or more shaping plasmaprocesses. In addition, the RF bias power can be higher during a DC-oncycle than during a shaping plasma process.

In one embodiment, the third high density plasma can be extinguished fora third shutdown period after the third dry-filling process has beenperformed. The third shutdown period can range from approximately 1second to approximately 10.0 seconds. Alternatively, the third shutdownperiod can range from approximately 4 seconds to approximately 20seconds. During the third shutdown period, the substrate temperature canchange. For example, the substrate temperature can decrease when theplasma is extinguished. In other embodiments, a shutdown period may notbe required during every cycle.

In one embodiment, a third amount of metal is deposited into a featureof the patterned substrate at a third rate during a third process timeusing the third high density plasma. The third dry-filling process mayinclude a number of fill cycles and a number of plasma off-cycles, and adry-filling process may be repeated a number of times (1-30) to obtainthe required fill amount. For example, a dry-filling process may includeduration times lasting from 1-1500 seconds for the fill cycles and/orthe off-cycles. For example, a NND process can be performed during thethird dry-filling process time; the third NND process can have a thirdfill rate; and the third fill rate can range from approximately +2nm/min to approximately +25 nm/min.

FIGS. 5 and 6 illustrate graphs of exemplary results in accordance withembodiments of the invention; and FIG. 7 illustrates a graph ofadditional exemplary results in accordance with embodiments of theinvention.

Alternatively, the additional process can comprise an LND process, anNND process, an annealing process, a conventional deposition process, anetching process, a deposition/etch process, a cleaning process, ameasurement process, a storing process, an electroplating process, or acombination thereof. The additional processes can be performed in thesame processing chamber or other processing chambers. For example, oneor more processing chambers can be coupled to each other by a transfersystem.

In 460, procedure 400 can end. A processing time may be used todetermine when to stop a process. Alternately, thickness data can beused to determine when to stop a process.

In some cases, the additional process can be a measurement process. Inone embodiment, the wafer can be removed from the processing chamber andmeasured in another chamber. For example, an optical digital profile(ODP) tool can be used. In addition, a Scanning Electron Microscope(SEM) tool and/or a Transmission Electron Microscope (TEM) tool can beused.

Measurement data can be obtained during a process and used to determinewhen to stop the process. Measurement data can include back sidepressure data, chamber pressure data, chamber temperature data,substrate temperature data, process gas chemistry data, process gas flowrate data, target material data, ICP power data, substrate positiondata, target power data, RF bias power data, processing time data,process recipe data, or a combination thereof.

In alternate embodiments, a dry-filling process may include a number ofDC-on cycles, a number of shaping plasma processes, and a number ofoff-cycles, and a dry-filling process can also be repeated a number oftimes (1-20) to fill the nano-sized features. For example, alternatedry-filling processes may include DC-on cycle times that can be equal toapproximately 10-1500 seconds, shaping plasma process times that can beequal to approximately 10-500 seconds, and off-cycle times that can beequal to approximately 5-100 seconds.

Barrier processes can be performed before the dry-filling processes andcan be performed in the same processing chamber or another processingchamber coupled to a common transfer system. For example, barrierrecipes may be as shown in Table 1. In the tables below, the headingsrefer to the following: Press (mT) Chamber Pressure in milliTorr ICP(kW) Inductively Coupled Power to RF antenna in kilowatts DC or DCT (kW)DC power to target in kilowatts Bias or TBP (W) Substrate Table BiasPower in watts D/P (sec) Deposition cycle time in seconds (preceded bynumber of cycles, if applicable) GD (nm) Deposited Film Thickness inFlat Field Area in nanometers BSP (T) Backside Gas Pressure in Torr Gap(mm) Target to Substrate Spacing in millimeters

Values separated by slashes (/) separate values for different subcycles,such as for deposition and etching, pulsed target power, etc. TABLE 1 N2Press. ICP DC Flow Bias BSP Gap (mT) (kW) (kW) (sccm) (W) D/T (sec) GD(nm) (T) mm) TaN LND 5 5.25 1.6 23 200 4 3 6 200 Ta NND 5 5.25 3.3 0 85011 11 (2.5) 6 252 TaLND 5 5.25 1 0 200 11.1 2 6 252

High and low pressure NND processes can also be performed in the sameprocessing chamber or another processing chamber coupled to a commontransfer system. For example, LND process recipes may be as shown inTable 2a, Table 2b, Table 2c, and Table 2d. TABLE 2a Press. ICP DC BiasBSP Gap Dep (mT) (kW) (kW) (W) D/T (sec) GD (nm) (T) (mm) Mode Cu 1st 905.25 3.2 100 6 × 10 6.8 8 255 NND(−30C) Cu 2nd 90 5.25 3.2 100 2400 2720 255 NND(−30C)

TABLE 2b Press. ICP Bias BSP Dep (mT) (kW) DC (kW) (W) D/T (sec) GD (nm)(T) Mode Cu 1st 90 5.25 3.2 100 6 × 10 6.8 8 NND(−30C) Cu 2nd 90 5.253.2 100 600 68 0 NND(−30C)

TABLE 2c Press. ICP Bias GD BSP Gap Dep (mT) (kW) DC (kW) (W) D/T (sec)(nm) (T) (mm) Mode Cu 1st 50 5.25 1.4 410 6 × 10 7 8 255 NND(−30C) Cu2nd 50 5.25 0.7/0 410 1200/1800 70 1 255 NND(−30C)

In this example, the Cu 1^(st) process included a 10 second continuousdry-filling cycle followed by a 10 second off cycle, and the Cu 2^(nd)process included a thirty second continuous dry-filling cycle, aforty-five second shaping plasma process followed by a twenty-fivesecond off cycle. TABLE 2d Press. BSP Dep (mT) ICP (kW) DC (kW) Bias (W)D/T GD (nm) (T) Mod Cu 50 5.25 1.4 410 6 × 10 7 8 NND(−30C) Cu 50 5.250.7/0 410 600/900 35 1 NND(−30C)

Multi-step dry-filling processes can be performed in the same processingchamber or another processing chamber coupled to a common transfersystem. For example, multi-step process recipes for dry-filling coppermay be as shown in Table 3a, Table 3b, and Table 3c. TABLE 3a Step DCP(kW) ICP (kW) TBP (W) Press (mT) Gap (mm) BSP (T) Cyc D/T (sec) GD (nm)1 1.4 5.25 410 50 255 8    6 × 10 s 8 2 1.4/0 5.25 410/410 50 255 1  6 ×25/60 s 20 3 1.4/0 5.25 410/103 50 255 0 15 × 30/60 s 60

TABLE 3b Step DCP (kW) ICP (kW) TBP (W) Press (mT) Gap (mm) BSP (T) CycD/T (sec) GD (nm) 1 0.75 5.25 850 50 200 8    6 × 10 s 6 2 .75/0 5.25850/850 50 200 1  6 × 25/60 s 15 3 .75/0 5.25 850/200 50 200 0 14 ×30/60 s 42

TABLE 3c Step DCP (kW) ICP (kW) TBP (W) Press (mT) Gap (mm) BSP (T) CycD/T (sec) GD (nm) 1 0.75 5.25 850 50 200 8    6 × 10 s 6 2 .75/0 5.25850/850 50 200 1  6 × 25/60 s 15 3 .75/0 5.25 850/200 50 200 0 14 ×30/60 s 42

In other embodiments, the additional process can include performing aprocess, and the LND process can be performed in the same processingchamber. Alternately, the additional process can be performed in adifferent ssing chamber, such as PVD chambers, CVD chambers, and PECVDchambers. A chamber pressure, chamber temperature, substratetemperature, a process gas chemistry, a process gas flow rate, a targetmaterial, an ICP power, rate position, a target power, a RF bias power,a process time, or a nation thereof can be adjusted to perform a LNDprocess. The process meters can be adjusted to provide a sputteringvalue in a range below a sputtering threshold during the LND process.For example, a controller can be and the RF bias power and the LNDtarget power can be adjusted to achieve an ultra-low deposition rate inthe field area of the patterned substrate, the ultra-low deposition ratecan be less than 30 nm/min.

As the dry-filling processes are performed, metal can be deposited intoand/or removed from nano-sized features of the patterned substrate whileproducing substantially no overhanging material at openings of thefeatures.

During processing, a DC-on process may add a small amount of material onthe field area on the top surface of the wafer, and a shaping plasmaprocess may be used to remove material on the field area of the wafer,and thus there is substantially no net deposition at the end of thedry-filling process cycle on the field area of the wafer. In addition,during processing, a DC-on process may add a substantially small amountof material to the openings of the nano-sized features on the wafer anda shaping plasma process may be used to remove material from theopenings of the nano-sized features on the wafer, and thus there are novoids in the metal deposited into the nano-sized features on the wafer.

In the metallization of high aspect ratio via holes and trenches onsemiconductor wafers, it is required that the barrier layer and the seedlayer have good sidewall and bottom coverage. The barrier layer needs tobe as thin as possible without sacrificing its barrier properties. Thebarrier layer must be thin because its electrical resistance, which addsto the electrical resistance of the via structure, must be minimized. Itneeds to be conformal and continuous to prevent diffusion of seed layermaterial into the dielectric layer and into other layers to preventreliability problems. This requires that the barrier layer thicknessmust be well controlled and minimized especially at the bottom of thevia. A thick barrier layer at the bottom of the via may add substantialundesirable electrical resistance to the resistance of interconnectmetallization.

Although only certain embodiments of this invention have been describedin detail above, those skilled in the art will readily appreciate thatmany modifications are possible in the embodiments without materiallydeparting from the novel teachings and advantages of this invention.Accordingly, all such modifications are intended to be included withinthe scope of this invention.

1. A method of filling a plurality of nano-sized features using adeposition system that includes a processing chamber, a gas supplysystem coupled to the processing chamber, an inductively coupled plasma(ICP) source coupled to the processing chamber, a metallic targetcoupled to the processing chamber, a DC source coupled to the metallictarget, a substrate holder coupled to the processing chamber, a RF biasgenerator coupled to the substrate holder, and a backside gas supplysystem coupled to the substrate holder, the method comprising: clampinga patterned substrate onto the substrate holder, wherein the substrateholder comprises an electrostatic chuck and an electrostatic force isapplied to the patterned substrate; applying a first backside pressureto a backside of the patterned substrate using a backside gas therebyestablishing a substrate temperature; creating a first dry-fillingplasma during a first dry-filling process, wherein a first amount ofmetal is deposited at a first rate into a plurality of nano-sizedfeatures of the patterned substrate; controlling the first dry-fillingplasma during a first shutdown time so as to allow the substratetemperature to decrease; decreasing a thermal conductivity between thesubstrate holder and the patterned substrate by applying a secondbackside pressure, wherein the second backside pressure is less than thefirst backside pressure thereby allowing the substrate temperature toincrease; creating a second dry-filling plasma during a seconddry-filling process, wherein a second amount of metal is deposited at asecond rate into the plurality of nano-sized features of the patternedsubstrate; and controlling the second dry-filling plasma during a secondshutdown time so as to allow the substrate temperature to decrease. 2.The method as claimed in claim 1, wherein: the controlling of the firstdry-filling plasma includes extinguishing the first dry-filling plasmaduring a first shutdown time, thereby allowing the substrate temperatureto decrease; and the controlling of the second dry-filling plasmaincludes extinguishing the second dry-filling plasma during a secondshutdown time, thereby allowing the substrate temperature to decrease.3. The method as claimed in claim 2, wherein a first dry-filling processtime is greater than 0 seconds and less than approximately 250 seconds,and the first shutdown time is equal to or greater than 0 seconds andless than approximately 50 seconds.
 4. The method as claimed in claim 2,wherein the first dry-filling process and the first shutdown time arerepeated N1 times, wherein N1 is an integer between 1 and
 20. 5. Themethod as claimed in claim 2, wherein a second dry-filling process timeis greater than 0 seconds and less than approximately 250 seconds, andthe second shutdown time is equal to or greater than 0 seconds and lessthan approximately 50 seconds.
 6. The method as claimed in claim 2,wherein the second dry-filling process and the second shutdown time arerepeated N2 times, wherein N2 is an integer between 1 and
 20. 7. Themethod as claimed in claim 1, further comprising: maintaining thebackside pressure at the first backside pressure during the firstdry-filling process, the first backside pressure being greater than orequal to 0 Torr and less than approximately 10 Torr; and maintaining thebackside pressure at the second backside pressure during the seconddry-filling process, the second backside pressure being greater than orequal to 0 Torr and less than approximately 8 Torr.
 8. The method asclaimed in claim 1, further comprising: maintaining the backsidepressure at the first backside pressure during the first dry-fillingprocess, the first backside pressure being greater than 0 Torr and lessthan approximately 10 Torr; and cycling the second backside pressurebetween a first value and a second value during the second dry-fillingprocess, the first value being greater than 0 Torr and less thanapproximately 5 Torr and the second value being less than approximately2 Torr.
 9. The method as claimed in claim 1, further comprising: cyclingthe first backside pressure between a first value and a second valueduring the first dry-filling process, the first value being greater than0 Torr and less than approximately 10 Torr and the second value beingless than approximately 8 Torr; and maintaining the backside pressure atthe second backside pressure during the second dry-filling process, thesecond backside pressure being greater than 0 Torr and less thanapproximately 8 Torr.
 10. The method as claimed in claim 1, furthercomprising: cycling the first backside pressure between a first valueand a second value during the first dry-filling process, the first valuebeing greater than 0 Torr and less than approximately 10 Torr and thesecond value being less than approximately 8 Torr; and cycling thesecond backside pressure between a third value and a fourth value duringthe second dry-filling process, the third value being greater than 0Torr and less than approximately 5 Torr and the fourth value being lessthan approximately 2 Torr.
 11. The method as claimed in claim 1, furthercomprising: operating the DC source at a first DC power during the firstdry-filling process, the first DC power level being greater than 0 Wattsand less than approximately 2000 Watts; and operating the DC source at asecond DC power during the second dry-filling process, the second DCpower level being greater than 0 Watts and less than approximately 2000Watts.
 12. The method as claimed in claim 1, further comprising:operating the ICP source at a first ICP frequency during the firstdry-filling process, the first ICP frequency being greater thanapproximately 1 MHz and less than approximately 100 MHz; operating theICP source at a first ICP power during the first dry-filling process,the first ICP power level being greater than approximately 1000 Wattsand less than approximately 6000 Watts; operating the ICP source at asecond ICP frequency during the second dry-filling process, the secondICP frequency being greater than approximately 1 MHz and less thanapproximately 100 MHz; and operating the ICP source at a second ICPpower during the second dry-filling process, the second ICP power levelbeing greater than approximately 1000 Watts and less than approximately6000 Watts.
 13. The method as claimed in claim 12, wherein the first ICPpower level is greater than approximately 4800 Watts and less thanapproximately 5600 Watts and the second ICP power level is greater thanapproximately 4800 Watts and less than approximately 5600 Watts.
 14. Themethod as claimed in claim 1, further comprising: operating the RF biassource at a first RF bias frequency during the first dry-fillingprocess, the first RF bias frequency being greater than approximately 10MHz and less than approximately 100 MHz; operating the RF bias source ata first RF bias power during the first dry-filling process, the first RFbias power level being greater than 0 Watts and less than approximately1200 Watts; operating the RF bias source at a second RF bias frequencyduring the second dry-filling process, the second RF bias frequencybeing greater than approximately 10 MHz and less than approximately 100MHz; and operating the RF bias source at a second RF bias power duringthe second dry-filling process, the second RF bias power level beinggreater than 0 Watts and less than approximately 1200 Watts.
 15. Themethod as claimed in claim 14, wherein the first RF bias power level isgreater than approximately 100 Watts and less than approximately 600Watts and the second RF bias power level is greater than approximately50 Watts and less than approximately 600 Watts.
 16. The method asclaimed in claim 14, further comprising: cycling the RF bias powerbetween a first value and a second value during the second dry-fillingprocess, the first value being greater than approximately 200 Watts andless than approximately 600 Watts and the second value being greaterthan approximately 100 Watts and less than approximately 600 Watts. 17.The method as claimed in claim 1, further comprising: performing a firstNo Net Deposition (NND) process during the first dry-filling process,wherein the first fill rate ranges from approximately +1 nm/min toapproximately +15 nm/min; and performing a second NND process during thesecond dry-filling process, wherein the second fill rate ranges fromapproximately +2 nm/min to approximately +25 nm/min.
 18. The method asclaimed in claim 1, further comprising: establishing a first substratetemperature during the first dry-filling process, the first substratetemperature being greater than or equal to approximately −50° Celsiusand less than approximately −10° Celsius; and establishing a secondsubstrate temperature during the second dry-filling process, the secondsubstrate temperature being greater than or equal to approximately 10°Celsius and less than approximately 150° Celsius.
 19. The method asclaimed in claim 1, further comprising: decreasing the thermalconductivity between the substrate holder and the patterned substrate byapplying a third backside pressure, the third backside pressure beingless than the second backside pressure thereby allowing the substratetemperature to increase; and creating a third dry-filling plasma duringa third dry-filling process, a third amount of metal being deposited ata third rate into the plurality of nano-sized features of the patternedsubstrate.
 20. The method as claimed in claim 19, further comprising:extinguishing the third dry-filling plasma during a third shutdown time,thereby allowing the substrate temperature to decrease.
 21. The methodas claimed in claim 20, wherein a third dry-filling process time isgreater than 0 seconds and less than approximately 250 seconds, and thethird shutdown time is equal to or greater than 0 seconds and less thanapproximately 50 seconds.
 22. The method as claimed in claim 20, whereinthe third dry-filling process and the third shutdown time are repeatedN3 times, wherein N3 is an integer between 1 and
 20. 23. The method asclaimed in claim 19, further comprising: maintaining the backsidepressure at the third backside pressure during the third dry-fillingprocess, the third backside pressure being greater than 0 Torr and lessthan approximately 4 Torr.
 24. The method as claimed in claim 19,further comprising: cycling the third backside pressure between a firstvalue and a second value during the third dry-filling process, the firstvalue being greater than 0 Torr and less than approximately 5 Torr andthe second value being less than approximately 2 Torr.
 25. The method asclaimed in claim 19, further comprising: operating the DC source at athird DC power level during the third dry-filling process, the third DCpower level being equal to or greater than 0 Watts and less thanapproximately 2000 Watts.
 26. The method as claimed in claim 19, furthercomprising: operating the ICP source at a third ICP frequency during thethird dry-filling process, the third ICP frequency being greater thanapproximately 10 MHz and less than approximately 100 MHz; and operatingthe ICP source at a third ICP power level during the third dry-fillingprocess, the third ICP power level being greater than approximately 1000Watts and less than approximately 6000 Watts.
 27. The method as claimedin claim 19, further comprising: operating the RF bias source at a thirdRF bias frequency during the third dry-filling process, the third RFbias frequency being greater than approximately 10 MHz and less thanapproximately 100 MHz; and operating the RF bias source at a third RFbias power level during the third dry-filling process, the third RF biaspower level being greater than approximately 50 Watts and less thanapproximately 500 Watts.
 28. The method as claimed in claim 27, furthercomprising: cycling the third dry-filling RF bias power between a firstvalue and a second value during the third dry-filling process, the firstvalue level being greater than approximately 200 Watts and less thanapproximately 600 Watts and the second value being greater thanapproximately 50 Watts and less than approximately 500 Watts.
 29. Themethod as claimed in claim 19, further comprising: performing a third NoNet Deposition (NND) process during the third dry-filling process,wherein the third fill rate ranges from approximately +1 nm/min toapproximately +15 nm/min.
 30. The method as claimed in claim 14, furthercomprising: establishing a third substrate temperature during the thirddry-filling process, the third substrate temperature being greater thanor equal to approximately 100° Celsius and less than approximately 250°Celsius.
 31. The method as claimed in claim 1, wherein the backside gassupply system operates to provide a backside gas comprising argon,helium, krypton, helium, radon, or xenon, or a combination thereof. 32.The method as claimed in claim 1, wherein the metal comprises tungsten(W), copper (Cu), tantalum (Ta), titanium, (Ti), ruthenium (Ru), iridium(Ir), aluminum (Al), silver (Ag), platinum (Pt), or gold (Au), or acombination thereof.
 33. The method as claimed in claim 32, wherein themetal comprises copper (Cu), or aluminum (Al), or a combination thereof.34. The method as claimed in claim 1, further comprising: providing aprocess gas to the processing chamber, wherein the process gas comprisesan inert gas, a nitrogen-containing gas, an oxygen-containing gas, or ametal-containing gas, or a combination thereof.
 35. The method asclaimed in claim 1, wherein a gap is established between a top portionof the processing chamber and the substrate holder, the gap being lessthan approximately 300 mm.
 36. The method as claimed in claim 1, furthercomprising: establishing a chamber pressure, wherein the chamberpressure is greater than or equal to approximately 10 mTorr and lessthan approximately 100 mTorr.
 37. The method as claimed in claim 1,further comprising performing an additional process before performingthe first dry-filling process, wherein the additional process includes abarrier layer deposition process, a seed layer deposition process, a LNDprocess, or a NND process, or a combination thereof.
 38. The method asclaimed in claim 1, further comprising performing an additional processafter performing the second dry-filling process, wherein the additionalprocess includes an electro-less plating process, an electroplatingprocess, a heat treatment process, an annealing process, a polishingprocess, a LND process, or a NND process, or a combination thereof.